The new wire bonder allows Wedge and Ball bonding through easy tool change in a device for wires up to 50 microns.
New is the 3 axes (X-Y-Z) motorized work, the Z-travel 30 mm with a resolution of 100 nm. Another highlight of this bonder is the mouse-controlled X-Y traverse with 50-mm and a resolution of 300 nm. Furthermore, a measuring device for setting and checking the base and Bond Force is integrated.
A Simatic PLC control enables any programmable loop height- and shape as well as the pro-gramming of a complete bond. The operation is now much more comfortable and ergonomi-cally via a 7 "touch panel display. A network connection on the device also enables the backup of parameters.
In addition to the standard features such as ultrasonic transducer (62 kHz), motor-based wire coil terminal microscope, etc., the device also has the ability to connect a camera as well as an optional tool Heater.
Exhibitor: UniTemp GmbH