The company UniTemp GmbH was found in August 2000. The corporate of objective is the development, manufacturing, sales and marketing of equipment for the microelectronicsIn the beginning the UTP series starts the successful way of the Rapid Thermal Annealing ovens. Meanwhile this kind of oven was improved and the new RTP and VPO series are well established on a world wide operating market. The key feature of these ovens are fast ramp up rates (up to 150 K/second up to 1200 °C and its working size up to 300mm wafer size).
Beside this ovens UniTemp is a specialist for small kind of reflow systems and their best seller for many years was the table top RSS series with a wide variety of options and accessories. The portfolio was rounded by the high precision hot plates HP Series which was sold in a lot of laboratories and universities world wide.
Another corporate of objective was the development of a semi automatic wire bonding machines with 3 motorized axis.
RSS-210-S Vacuum Reflow Solder System (210x210mm solder area)
The RSS-210-S is used for process development and small series production. The System is equipped with a SPS SIMATIC Controller and an ergonomic 7" touch Panel. The System allows the use of flux and other contaminating material as the chamber is to be very easy cleaned.
Standard scope if delivery is a mass flow Controller for 5 nlm Nitrogen. There is optionally available a high vacuum Version and a bubbler for use of formic acid. Also pure Hydrogen can be used optionally.
RSS-110-S and RSS-160-S
The new RSS series has 110 x 110 mm or 160x 160 mm solder area and can be equipped with a bubbler for formic acid. The very small table top Systems are comfortable equipped with a SPS SIMATIC Controller and 7" touch Panel. They are vacuum capable up to 10exp-3 hPa and optionally the can be used also with 100% Hydrogen.
RTP-150 Rapid Thermal Annealiung oven up to 1000 °C
RTP/RTA Oven: The RTP-series is a kind of single wafer rapid thermal vacuum processing/annealing oven with front loading (drawer) for up to 150 mm wafer size. The fast ramp up rate (up to 150 °C/second) and its small lab size are a excellent tool for developing various semiconductor processes or solar cell annealing. For high vacuum up to 10e-6 mbar. The maximum temperature is up to 1200 °C (RTP-100).
The new wire bonder allows Wedge and Ball bonding through easy tool change in a device for wires up to 50 microns.
New is the 3 axes (X-Y-Z) motorized work, the Z-travel 30 mm with a resolution of 100 nm. Another highlight of this bonder is the mouse-controlled X-Y traverse with 50-mm and a resolution of 300 nm. Furthermore, a measuring device for setting and checking the base and Bond Force is integrated.
A Simatic PLC control enables any programmable loop height- and shape as well as the pro-gramming of a complete bond. The operation is now much more comfortable and ergonomi-cally via a 7 "touch panel display. A network connection on the device also enables the backup of parameters.
In addition to the standard features such as ultrasonic transducer (62 kHz), motor-based wire coil terminal microscope, etc., the device also has the ability to connect a camera as well as an optional tool Heater.
Phone: +49 8441 787663
Get in contact with German companies in 3 easy steps! With one single question you can reach all relevant German Pavilion exhibitors of your selected industrial branch.
Click here if you notice an image that violates copyright or privacy rights.